Technical Specifications

Characteristics	Specifications
Statistical analysis	• Maximum and average solder voids/non-wetted areas percentage calculation at pad, product, and lot level • Pass/fail verification compliant with international standards (IEC, JEDEC and IPC)
Automated report generation	• Visualization of solder voids/non-wetted areas and pads for each device • Heatmap illustrating solder voids/non-wetted areas distribution for all the devices in the lot
Device and X-ray machine agnostic	• Compatible with and can operate seamlessly across various types of devices and X-ray machines